新加坡商寶吉特有限公司台北分公司
English Required
Manager/Teamleader IC Design - Taipei Office
10/17 Updated
Full-time
Executive Level
English RequiredSalary & Location
Salary negotiable
(Regular monthly salary of NT$40,000 or above)
台北市內湖區
Required
Language Requirements
English
聽/精通、說/精通、讀/精通、寫/精通
Work Experience
10年以上
Job Description
Development:
‧ Assist management team in IC roadmap and product definition specification.
‧ Manage a team of IC designer with responsibility to bring design to production.
‧ Perform as project manager to lead project execution.
‧ Perform IC specification and RTL design.
‧ Perform design verification, building testbench and testcases.
‧ Perform design code review and maintain design quality.
‧ Perform top-level integration and support backend activities for tape-out.
‧ Perform system validation through FPGA prototyping.
‧ Support Silicon validation and IC production.
‧ Perform design documentation.
‧ Manage third party design house or backend support
‧ Support IC design infrastructure like IT, tools, software, design server etc.
‧ Study and keep up knowledge of industrial spec, e.g. USB, Power Delivery, Audio, I2S, I2C etc.
Technical/Customer Support
‧ Provide technical support to key customers and field engineers.
‧ Customer design-in support.
‧ Prepare training material and conduct training, if needed.
Requirements:
‧ Degree/Master in Electrical/Electronic Engineering
‧ 10-15 years experience in the area of digital IC design
‧ 5-10 years experience in managing a design Centre
‧ Working experience from design to silicon are essential
‧ Knowledge and working experience with wired and wireless connectivity technology are desirable.
Number of Openings
1~1人
Educational Requirements
大學(學院)以上
Field of Study Requirements
資訊工程相關、電機電子工程相關、其他工程相關
Work Schedule
日班
Leave Policy
週休二日
Job Category
Electronics Engineers
Digital IC Design Engineer
Analog IC Design Engineer
台北市內湖區
半導體製造業
Bridgetek is a leading global semiconductor company providing high performance microcontroller units (MCUs), display IC products and developing innovative silicon solutions that enhance seamless interaction with latest connectivity technologies. Our key objective is to provide core bridging technology in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
More information is available at http://www.brtchip.com
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