1. SoC/ASIC/Testchip & package architecture designs for high speed Analog/Serdes, D2D, and HBM2/3/4 integrations (Server, Networking, Wireless, AI, AR). 2. Execute SI/PI/EMC design-optimization for chip/package/system integration and electrical performance optimization, e.g., eye diagram, jitter, IR/EM, system-PI, cross-talk, and SSN/SSO. 3. Develop system integration design guidelines with SI/PI total solution for advanced packaging technologies (InFO/CoWoS/3D-IC). 4. Working as R&D with customers on technology competitive analyses, and develop chip/package/system technology road map for future productivity.

1.負責總務管理，包括團膳、廠區安全保全、廠區環境維護、清潔人員管理、廢棄物處理、公務車等業務。 2.空間管理，包括空間規劃和辦公區管理。 3.制定行政總務管理規章和機制，確保辦公室運作順暢。 4.督導並落實廠區服務之日常管理。 5.承接主管交辦專案和行政相關工作。

1. Requirement Analysis 2. Algorithm Development 3. System Architecture Design 4. System Modeling 5. Technical innovation research

1. 差勤管理 2.招募聯繫 3.行政文書處理 4.文件管理 5.會計帳務處理 6.配合會計師各項帳務作業 7.會計師往來聯繫窗口 8.請購、採購作業 9.辦公室庶務 10.鼎新ERP操作 11.其他主管交辦事項

1. Capacitive touch screen controller FW development 2. Touch algorithm development 3. Anti-noise algorithm development - NFC noise, EFT noise, LCM noise, charger noise... etc. 4. Analyze and solve the abnormal problem about touch performance. 5. 需國外出差 - 協助客戶快速解決問題。 - 對 FAE 做教育訓練, 讓 FAE 也能協助處理客戶問題。 6. 經培訓後，專業能力達標的前提下，能接受海外長期出差的申請者將優先考慮。

1.設備預防保養、組裝與改善作業 2.執行5S環境維護作業 3.配合生產需求輪班 4.需耐久站

Role and Responsibilities • Design, implement, debug, and characterize acoustic systems for optimal sound performance, including to predict acoustic performance. • Develop acoustic structure design, ensuring proper integration with mechanical components. • Collaborate with 3rd party contract manufacturers to produce demonstration systems, considering acoustic requirements. • Design and manage the assembly, testing, debugging, and integration of acoustic systems into prototype and demonstration consumer audio systems. • Provide technical support for xMEMS customers and field personnel, focusing on acoustic aspects of the systems. • Guide customers through acoustic testing, debugging, and troubleshooting of audio systems. • Troubleshoot and resolve technical issues related to acoustics, working with cross-functional teams (Electrical, Mechanical, Software, Quality, Reliability). • Perform acoustic measurements to validate designs and identify potential issues. • Track test progress, analyze results, and generate reports on acoustic performance. • Conduct training for field personnel and customers on acoustic principles, troubleshooting, and optimal system use. • Contribute to the definition of next-generation audio products, focusing on acoustic performance improvements. Qualifications and Education Requirements • BS or MS in Mechanical Engineering, Acoustics, Physics, or a related field. • 5+ years of experience in acoustics, mechanical engineering, or related fields, with experience in audio applications or systems a plus. • Strong understanding of acoustic system design principle, and experience with earbuds, headset, wearable and desktop products is a plus. • Experience analyzing and evaluating audio products with hardware tools such as B&K, GRAS, Audio Precision, Listen Inc. (Soundcheck) or similar. • Ability to work effectively in a cross-functional team environment. • Excellent communication, collaboration, and problem-solving skills. • Fluency in English and Chinese (desired). • Ability to commute daily to the office in Zhubei. • Guide customers through acoustic testing, debugging, and troubleshooting of audio systems. • Understanding of the industries and markets in acoustic application fields and adapting to the needs of different applications. Preferred Skills • Familiar in acoustic simulation software (e.g., COMSOL Multiphysics, Ansys Sound).

1、Experienced in mixed-signal MOS transistor level layout design. 2、Can perform low-noise and less parasitic analog layout design. 3、Knowledge of Analog and Digital layout integration is a plus. 4、Can perform LVS, DRC, and ERC checks. 5、Can perform top-level floor planning, which includes efficient block arrangement, proper placement of I/Os, and considering ESD path. 6、Understands the effect of layout parasitic especially on sensitive blocks such as VCO and high-speed circuits. 7、Proficiency on commonly used EDA tools for layout design such as Cadence Virtuoso and Laker

The Opportunity Central Engineering AMS-IP team provides leading-edge SerDes PHY solutions and other Analog Mixed-Signal IPs to support all Marvell products. Job Responsibilities: ASIC design engineer responsible for the design, verification and evaluation of digital circuits in high-speed data communication ICs. The candidate will be involved in verification plan development, test environment setup, modeling, testcase development and execution. He/She will be responsible for block and /or chip level verification. The responsibilities include but not limited to. * Improve the design methodology and flow. * Design verification for various type of SerDes IPs ranging from 10Gbps to 224Gbps data-rates for different applications. * Collaborate with Analog/DSP/Digital Design/FW/AE teams to deliver the competitive SerDes IP solutions for all the Marvell product lines. * Provide the support to the product teams, for both pre and post silicon

Quality and Reliability group are responsible for NPI product qualification, ongoing reliability monitoring, reliability data analysis and life prediction, second source qualification and change qualification, Qualification failure analysis and reliability planning and reporting. We work closely with other functional teams involved in NPI and subsequent product quality. Job Responsibilities: * Work with BU and operations team for NPI requirements planning and technical risk assessments. * Manage multiple product reliability qualifications, from planning to execution and debug. * Coordinate internal and external hardware and engineering resources for reliability qualifications and projects. * Develop qual hardware and its bring-up for qual. * Analyze stress data and results to evaluate the Reliability performance of Logic/Array/Analog Cores IP/Silicon Photonics. * Review and Analyze the ESD/HBM/CDM/LU test results and feedback to design teams for future improvement. * Summarize project findings and results into final qualification reports for customers. * Develop and monitor reliability monitoring programs to establish MTBF, FIT and other reliability metrics. * Drive 8D troubleshooting and root cause analysis of qual failures to improve product reliability. Desired Experience: * Experience in IC quality, product and qualification * Past experience working with 3rd party reliability vendors * Experience with reliability lifetime modelling and calculation * Knowledge for silicon product level reliability qualification and lifetime behavior model. * Knowledge for reliability failure modes of silicon/packaging technologies and failure mechanisms with respect to reliability. * Experience with reliability HW setups and equipment for life, environmental, ESD, Latch-Up, etc., testing. * Experience in second source qualification and bring up.

1.技術支援（Techinical Support)：具備技術知識和現場經驗需要能協助客戶解決產品問題 或是協助客戶培訓相關知識或技能。 2.產品簡報（Product Presentation）：需要向客戶展示產品功能、應用、維護等不同面向的產品介紹 3.客戶關係維護（Customer Relationship Management）：與客戶建立長期夥伴關係，維護顧客關係。 4.完成客戶專案的技術支援Debug和客戶專案的跟蹤Design tracking。 5.市場訊息搜集和回饋，協助銷售完成新產品的推廣。

USB 系統驗證, IC 測試驗證, 客戶問題回覆, 電子線路設計驗證, PCB Layout, 電腦組裝, IC RMA 報告, USB-IF 測試驗證環境建立, WHQL 認證測試環境建立, 偶爾出差大陸, 英文說寫回客戶 email.

1. 預測銷售量，並擬定生產計畫。 2. 負責產銷協調。 3. 規劃生產排程，並評估人力、機器設備、零件原物料之需求。 4. 考量工人能力、機器限制、生產計畫和生產進度等因素，進行適當之工作分配。 5. 提出有關操作、原料分配、設備安排等相關的修正建議，以增加生產量或提升品質。 6. 提出有關現存的品質或生產標準方面的修改建議，以達到最理想的產品品質。 7. 整理分析生產記錄報告，並對進度加以催查及管制。

1.自動化設備流程規劃設計與設備電控成本估價 2.電氣控制回路圖設計﹑繪製(AUTOCAD)及BOM表製作 3.伺服馬達﹑步進馬達﹑線性馬達控制與調校 4.工業配電 5.機械手臂程式與控制

1. 根據公司的業務目標，制定專案計劃和策略。 2. 負責業務專案計劃的執行、跟進、控制，確保按時完成。 3. 負責溝通管理客戶需求，制定解決方案，並與相關部門協調合作。 4. 負責專案成本控制，確保專案獲得最大收益。 5. 業務開發和客戶維繫。

1.目標為各類燒錄器的軟軔硬體開發。 2.有老師傅帶領，可以事半功倍的學習。 3.可上官網看一下燒錄器相關資訊。

1. 音訊演算法之開發與調校 2. 數位信號處理之浮點與定點模擬實作 3. 協助客戶分析與解決產品聲學效能問題 4. 音訊測試自動化工具開發與維護 5. 依據需求及規範訂定音訊測試標準

1. 協助客戶開發及量產問題: 技術支援、專案協調 2. 須具備日語/中文能力進行技術溝通及協調 3. 具備MCU開發經驗者為佳: 了解SPI/I2C通信協議 4. 有系統整合或驅動移植的相關經驗者為佳

【工作內容】 1. 進行電性故障分析實驗及相關測試設備操作 2. 工程實驗討論及技術諮詢，實驗結果判定與分析報告撰寫 3.年薪依個人表現而異，表現優異之工程師年薪可達85萬，表現優異之副工程師年薪可達75萬 4.津貼優於業界

工作內容： 1. 執行TEM機台操作、客戶樣品成分分析。 2. 編輯分析結果，撰寫相關資訊。 3. 年薪依個人表現而異，表現優異之工程師年薪可達85萬，表現優異之副工程師年薪可達75萬 4. 夜班津貼優於業界