力成科技股份有限公司
技術工程類-研發工程師Package designer(記憶體封裝)
9/9 Updated
Array
English Required
Full-time
Mid to Senior Level
English RequiredSalary & Location
Salary negotiable
(Regular monthly salary of NT$40,000 or above)
新竹縣湖口鄉
Required
Language Requirements
English
聽/中等、說/中等、讀/中等、寫/中等
Work Experience
1年以上
Job Description
A. Package design
1. Package RFQ for cost estimation
2. New device package feasibility & technical risk assessment
3. Package structure, BOM design
4. Package design rule setup & update
5. Coordinate DR0 design review meeting
6. PKG structure confirmation after setup
B. Package research & development
1. Research & setup package roadmap / material roadmap
2. New package development
3. New material survey & capability development
4. Setup direct material purchase specification
5. Technical benchmark with competitors (Reverse engineering)
Number of Openings
1~1人
Educational Requirements
大學(學院)以上
Work Schedule
日班
Leave Policy
週休二日
Job Category
Project Sales Supervisor
Semiconductor Engineer
Semiconductor Process Engineer
新竹縣湖口鄉
半導體製造業
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