力成科技股份有限公司
技術工程類-研發工程師Package designer(邏輯IC)
9/9 Updated
Array
English Required
Full-time
Mid to Senior Level
English RequiredSalary & Location
Salary negotiable
(Regular monthly salary of NT$40,000 or above)
新竹縣湖口鄉
Required
Language Requirements
English
聽/中等、說/中等、讀/中等、寫/中等
Work Experience
1年以上
Job Description
This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip)
1.Package RFQ and structure & BOM selection.
2.Direct material evaluation and survey.
3.FA and Reverse Engineering.
4.Package design rule maintain & update.
5.Advance products design / NPI projects development.
6.Research & setup package roadmap / material roadmap.
Number of Openings
1~1人
Educational Requirements
碩士以上
Field of Study Requirements
電機電子工程相關、機械工程相關
Work Schedule
08:30~17:30
Leave Policy
週休二日
Job Category
Semiconductor Engineer
Semiconductor Process Engineer
新竹縣湖口鄉
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