瑞軒科技股份有限公司
W_韌體研發工程師(Android BSP)
11/1 Updated
Full-time
Entry-level
English Required
0 ~ 5 applicants

Salary & Location

Salary negotiable
(Regular monthly salary of NT$40,000 or above)
新北市中和區

Required

Language Requirements
English
聽/中等、說/中等、讀/中等、寫/中等
Work Experience
不拘

Job Description

1. Android BSP, Linux driver Development.
2. System Bootloader Development.
3. Android HAL, Framework Development and Integration.
4. Hardware Board Bring up and Performance Tuning.
5. Troubleshooting and debugging.
Number of Openings
3~5人
Educational Requirements
大學(學院)以上
Field of Study Requirements
資訊工程相關、其他數學及電算機科學相關、工程學科類
Work Schedule
日班
Leave Policy
依公司規定

Job Skills

System Integration Analysis
Software Engineering Development
Firmware Engineering Development
Software Programming
系統整合分析 軟體工程系統開發 韌體工程開發 軟體程式設計
Job Category
Android Engineer
Software Engineer
Firmware Engineer
0 ~ 5 applicants