1.Device Characterization and Verification : New product preformance test for datasheet generation prior to manufacturing release and check if product can meet the target performance 2.Development of engineering database : Device Characterization, Product Testing, Device Physical or Mathmatical & Statistical Analysis etc 3.Development and monitoring for production products based on customer interests (Improving and updating existing product solutions) : New product development with rough creating idea or concept using computer software and device characteristics re-verification based on customer requirements 4.Disposition of wafer CP spec, Assembly and final test spec : Wafer Cip Test or Assembly or Final Test or QC spec generation with processed target wafer 5.Yield enhancement and management : This safety for yield management must ensure product design meets and all safety regulations and finally, The products can go MP well 6.Coordinating or Collaborate with core team (with QA, Assembly, GPM... etc) : Collaborate with many core team to define realistic product targets 7.Conducting market research to inform development decisions : Conduct market research and trend with design team and discuss the product to be developed 8.Meeting and discussion with development team to discuss product ideas : Discuss & Feedback to development team to set up new concept or further improvement for own technology potential or baseline 9.Overseeing production and ensuring that products conform to market specifications

1.Generating new device architectures and setting up key process modules required for new cutting-edge Field-Stop Trench IGBT & FRD technology development 2.TCAD simulation and DOEs planning to realize new concepts, and wafer probing & assembled performance data analysis for each learning cycle 3.Wafer cost analysis, wafer probing yield analysis & yield-up activities for the new innovative technologies 4.Derivative technology development, based on proven technologies 5.New product introduction (Massive full line-up products development, from design tape-out to production), based on latest released technologies, closely working together with Marketing and Application teams

1.Generating new device architectures and setting up key process modules required for new cutting-edge MV Shielded-Gate Trench MOSFET technology development 2.TCAD simulation and DOEs planning to realize new concepts, and wafer probing & assembled performance data analysis for each learning cycle 3.Wafer cost analysis, wafer probing yield analysis & yield-up activities for the new innovative technologies 4.Derivative technology development, based on proven technologies 5.New product introduction (Massive full line-up products development, from design tape-out to production), based on latest released technologies, closely working together with Marketing and Application teams

1. Setting up key process modules required for new cutting-edge HV SuperJunction MOSFET technology development 2. Wafer probing & assembled performance data analysis for each learning cycle 3. Wafer probing yield-up and industrialization activities for the new innovative technologies 4. Derivative technology development support, based on proven technologies

1. Setting up key process modules required for new cutting-edge HV SuperJunction MOSFET technology development. 2. DOEs planning to realize new concepts, and wafer probing & assembled performance data analysis for each learning cycle. 3. Wafer cost analysis, wafer probing yield analysis & yield-up activities for the new innovative technologies. 4. Process module optimization for derivative technology development, based on proven technologies.

1.無塵室作業環境，需著全套無塵服 2.生產線機台操作/異常反應 3.可配合三班輪班制(一季一輪)，周休二日 4.假日視工作情況須配合加班 5.細心、團隊溝通能力、自我學習能力、邏輯思考能力 6. 基本英文能力(機台介面)、Office 基本操作 *無經驗可 ，歡迎社會新鮮人 *須配合加班,加班費優於勞基法 *生產獎金另計

1.無塵室作業環境，需著全套無塵服，亦有不須穿無塵服區域 2.生產線機台操作/異常反應 3.可配合四班二輪(做二休二)休假制度 4.完成主管交辦事項 *無經驗可，歡迎社會新鮮人 *須配合加班，加班費優於勞基法 *可選擇固定早班(07:30~19:30)或固定夜班(19:30~07:30) *生產獎金另計

1.庫存數量、文件核對。 2.生產線原物料收發及托運。 3.出貨整合、標籤加貼及更改作業。 4.每月原物料庫存盤點作業。 5.完成主管交辦事項。 6.可選擇班別： 做二休二：07:30-19:30 常日班：08:00-17:00