職務概況
待遇面議
（經常性薪資達 4 萬元或以上）
新竹縣湖口鄉
條件要求
語文條件
英文
聽/中等、說/中等、讀/中等、寫/中等
工作經歷
1年以上
職務描述
A. Package design
1. Package RFQ for cost estimation
2. New device package feasibility & technical risk assessment
3. Package structure, BOM design
4. Package design rule setup & update
5. Coordinate DR0 design review meeting
6. PKG structure confirmation after setup
B. Package research & development
1. Research & setup package roadmap / material roadmap
2. New package development
3. New material survey & capability development
4. Setup direct material purchase specification
5. Technical benchmark with competitors (Reverse engineering)
需求人數
1~1人
學歷要求
大學(學院)以上
上班時段
日班
休假制度
週休二日
職務類別
Project Sales Supervisor
Semiconductor Engineer
Semiconductor Process Engineer
