The FAE position should be easy to work with and with their broad knowledge they should be perceived as an extension of the customers design team [Engineering Intimacy]. The FAE must be able to pull in the necessary resources within the company to provide the customer with quick turnaround on all their engineering challenges.

RESPONSIBILITIES

• Utilize all product offerings, providing insightful and detailed design solution.

• Present design solutions to customer team, utilizing solid model design techniques during presentation.

• Manage and direct a product development design team consisting of multiple engineering disciplines.

• Drive prototype, tool build, and initial production build to meet customer timelines.

• Keep work skills current to insure Laird competitiveness in a dynamic global business environment. May require extensive travel to customer sites required providing design specific solutions.

• Manage and coordinate activities between departments to meet product development requirements.

REQUIREMENTS

• Familiar with Thermal dynamic and EMI debug products, covering Thermal Interface Material, EMI gasket, Elastomer, Paste, Metal/Shielding, Absorber, Inductive Components. With understanding of RF related product design is a plus.

• Experience in software such as HFSS, CST, ANSYS or Flotherm will be preferred.

• Proficient with solid-modeling software, preferable Pro/Engineering.

• Personal computer skills such as MICROSOFT OFFICE and relational database.

• Excellent communication skills

• Ability to work well in a Team environment and under direct supervision.

• Effectively present information and respond to questions from groups.

• Ability to work with clearly defined project steps.

EDUCATION / EXPERIENCE

• Bachelor's Degree in engineering or technical field, Major in Material Science or Radio will be preferred.

• Knowledge in material development or Thermal/EMI/EMC products will be preferred.

• Experience and knowledge in QA testing procedures will be preferred.

• Engineer with at least 3-5 years of design experience. To engage in early participation in PCB board level design to help identify and prevent potential EMC and Thermal problems.