Molex Taiwan Ltd._台灣莫仕股份有限公司
Sr. CAE Engineer, Material Modeling (彈性工作地點:淡水/新店/三重/hybrid)
10/4 更新
Array
全職
經理/總監
部分遠端
職務概況
待遇面議
（經常性薪資達 4 萬元或以上）
新北市淡水區
條件要求
語文條件
英文
聽/精通、說/精通、讀/精通、寫/精通
中文
聽/精通、說/精通、讀/精通、寫/精通
工作經歷
5年以上
職務描述
Your Job
- Molex is seeking a world class, self-directed Sr. CAE Engineer to develop advanced FEA modeling techniques for glass fiber reinforced plastic (e.g. LCP) materials used in high-speed datacom interconnect products, and to develop next generation high-speed interconnect product. This role requires in-depth understanding the behavior of glass fiber reinforced plastic materials, as well as relevant simulation experience using commercially available FEA tools.
Our Team
- At Molex, we not only employ some of the most talented people from all over the world, we work to help cultivate tomorrow's breakthroughs. From our corporate headquarters in Lisle, IL to manufacturing floors around the world, the Molex team is dedicated to helping further the limits of technology.
What You Will Do
-Characterize the mechanical properties of glass fiber-reinforced plastic materials (e.g., LCP). Develop FEA modeling techniques to accurately simulate these mechanical characteristics and correlate the results with experimental tests.
-Model and simulate the prediction of fiber orientation during injection molding process of polymer composite. Map the predicted fiber orientations and calculated material properties to Abaqus for structural finite element analysis.
-Lead the development of new products and direct the activities of multifunctional team(s) according to the priorities set by engineering management.
-Conduct and coordinate FEA simulations for high-speed interconnect systems.
-Recommend changes in designs or technical procedures.
-Provide input, ideas, and suggestions to create effective structural design guidance and documentations.
-Work in laboratory environment to obtain material property and capture force-displacement curve using Instron machine.
-Stay updated on emerging technologies in Mechanical Engineering for Data Center products, drive research in areas including interference fit, thermal aging and anisotropic material modeling.
-Publish technical papers and patents.
Who You Are (Basic Qualifications)
- B.S. Degree in Mechanical or Related Engineering Discipline
- 3+ years of Mechanical/Material Engineering Experience.
- 3+ years of ABAQUS FEA Simulation Software Experience.
- 2+ years of experience in CAD software and product design, such as NX.
- Experience in composite glass fiber reinforcement plastic material modeling.
- Experience with injection molding tool, such as MoldFlow or Moldex.
- Experience with glass fiber mapping tools, such as DigiMat or Converse.
What Will Put You Ahead
- M.S. or Ph.D. Degree in Mechanical/Material Engineering or Related Engineering Discipline.
- Experienced in mechanical testing for validation of simulation purposes.
- Established records of invention such as patent ownership or technical paper authorship.
At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate’s knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.
需求人數
1~1人
學歷要求
大學(學院)以上
科系要求
電機電子工程相關、機械工程相關
上班時段
日班
休假制度
週休二日
工作技能
New Product Research and Testing
Hardware Engineering Technology Development
Hardware System Research & Development Design
Electronic Circuit Design
新產品研發與測試 硬體工程技術開發 硬體系統研發設計 電子電路設計
職務類別
Mechanical Engineer
Heat Transfer Engineer
Hardware Development Engineer
新北市淡水區
電腦及其週邊設備製造業
認識MOLEX公司
Molex於1938年成立於的美國的伊利諾州，並於2013年被美國科氏工業集團（英文名稱Koch Industries）收購，成為私人公司。
目前Molex在全球40個國家分別設有據點及工廠並擁有超過10萬種產品，這些產品皆由超過 40,000 名敬業的員工一起努力完成。
在2014年時，光聯通訊(Oplink Communications Co., Ltd.) 亦被科氏工業集團收購，並由科氏工業集團中的子公司Molex莫仕公司管理，為美國莫仕公司旗下一員。
全球電子解決方案領先企業
Molex是一家先進電子元件全球龍頭供應商，提供各種連接器、電纜元件、介面方案和壓接工具，服務於電信、電腦網路、交通、消費類產品和航空航太等領域。每年，我們提供的解決方案成為這些行業的標準，並推動了這些行業的創新。我們是一家真正的全球性公司，擁有世界一流的製造基地，並且財力雄厚。作為公司的一員，你不僅有很多機會增長個人技能，實現個人目標，也能支援全球的技術領先地位。
我們提供服務的行業，包括：消費類產品、電子設備、移動設備、電腦和汽車行業。30多年來，我們在台灣建設世界一流設施，全面建設員工隊伍，並發掘該地區的業務增長機會。
認識Oplink公司
光聯通訊(Oplink Communications Co., Ltd.)為全球著名企業美國科氏(Koch)工業集團下屬莫仕(Molex)公司之全資企業，致力於為各種應用提供創新型光纖及集成解決方案。莫仕公司除了發展光纖業務外，還服務於移動設備、通信、消費電子、工業和醫療電子領域，是全球領先的互連產品和集成解決方案提供商之一。光聯通訊則是全球最重要的光無源和有源通訊器件、模組及子系統供應商之一，服務于全球通訊領域一流的電信、數據通訊和有線電視設備製造商等，實踐以市場為基礎的管理思想(Market Based Management)，為客戶提供創新型系統集成解決方案，打造對社會有真正價值的產品。
